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Chip bonding is a process for attaching electronic components to a circuit board using a special adhesive. Using this technique during SMT assembly significantly increases the reliability and service life of electronic assemblies.

A-CONTRACT uses chip bonding technology to create highly reliable electronic components. The use of certified adhesives and precise automated dispensing systems ensures a controlled and repeatable process that meets industry standards.

PROJECTS FOR WHICH A-CONTRACT RECOMMENDS CHIP BONDING:

// Devices with increased reliability requirements. Electronic components manufactured using chip bonding have a longer service life under conditions of severe vibration and shock loads.
// High-tech assemblies. The adhesive ensures that expensive components will not detach during installation or during operation.
// Double-sided mounting boards. This technology allows for mounting on both sides of the board without compromising the integrity of components on the underside.
// Fixing heavy components. The adhesive securely holds heavy components (e.g., BGA chips, inductors, large capacitors, and connectors) during soldering and provides additional stability during subsequent use of the PCB.

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Chip bonding is most in demand in the production of devices for applications where equipment is subject to constant vibration and temperature fluctuations, such as automotive electronics, industrial equipment, and avionics. The adhesive absorbs mechanical stress and compensates for thermal stress, preventing component separation.

ADVANTAGES OF ASSEMBLYING PRINTED CIRCUIT BOARDS USING ADHESIVE:

// Maximum assembly reliability, reduced risk of costly repairs.
// Design freedom – the ability to effectively use the board area on both sides.
// Confidence in the quality of the product and successful completion of certifications.

HOW DOES THIS WORK?

The chip bonding process at A-CONTRACT includes four key stages:

// Automated dispensing: precise application of adhesive.
// Component placement: automatic positioning.
// Curing: As the adhesive passes through the oven, it hardens and the component is securely fixed to the board.
// Soldering: Forming the final connection on the SMT line.

Chip bonding at A-CONTRACT is a sophisticated engineering solution for increasing mechanical strength, assembly safety, and the durability of electronic devices.

We invite you to visit the A-CONTRACT company stand and see for yourself samples using this technology.

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How A-CONTRACT improves the reliability of electronic assemblies: the use of chip bonding technology in production